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Bond Corporation Pte. Ltd.

Bond Corporation Pte. Ltd. has been acquired by a public company.
PrivCo has ceased its coverage of Bond Corporation Pte. Ltd. and below is the archived report.

Business Summary

Bond Corporation Pte. Ltd. is a company that operates in the following industries: Mechanical Design & Development Services and Mechanical & Electrical Repair. The company was founded in 1979. Bond Corporation Pte. Ltd. headquarters are located in Singapore. Bond Corporation Pte. Ltd. operates as a subsidiary of Hollysys Automation Technologies Ltd.

Overview & Corporate Organization

Basic Information

Year Founded:1979
Country:Singapore

Corporate Organization

Parent Companies:

Industry Information

Industry Codes

PICS™:1300410™, 1300605
NAICS:View
SIC:View

The PrivCo Industry Classification System™ (PICS) is our proprietary, modernized industry classification system, geared especially toward privately-held companies and including newer emerging sub-industries that are not reflected in other outdated industry classification systems, such as SIC and NAICS.

Ownership

PrivCo's Ownership table displays who owns Bond Corporation Pte. Ltd., including owner name, each type of owner (whether family, individual, private equity firm, etc.)
Owner NameType of Owner% Ownership Stake
ViewViewView

Mergers & Acquisitions

PrivCo's M&A Activity table for Bond Corporation Pte. Ltd. displays the mergers and acquisitions involving Bond Corporation Pte. Ltd., for example if Bond Corporation Pte. Ltd. acquired or was acquired by another entity, any leveraged buyout (LBO), etc.
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DateStatusTargetBuyerDeal TypePrice
DetailsMar. 2013CompletedView1ViewAcquisitionView
Notes
1Hollysys, based in Beijing, will...Read More →
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You are viewing a free limited preview of Bond Corporation Pte. Ltd.
For Full Access: Unlock This Company Report For $99 or Upgrade To PrivCo Premium Subscription For Full Site-Wide Access